STMicroelectronics Components on ICGOODFIND SiteMap
最新文章
- Yongxi Electronics Drops $1.4B on Advanced Packaging – Can It Survive the 8-Year Climb?
- SMIC Completes Asset Acquisition, Big Fund Becomes Third‑Largest Shareholder
- Kuaishou‑Spun Lingchuan Secures Series A+ Funding for Video AI Chip Expansion
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- Japan Pours Another ¥150B into Rapidus as 2nm Fab Push Intensifies
- Qualcomm in Talks to Buy AI Chip Firm Modular for $4B
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- Xnergy’s 3300V SiC MOSFET Cuts Solid‑State Transformer Cost by Up to 35%
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- STMicroelectronics Issues $1.5B Convertible Notes to Refinance Debt
- Marvell Unveils Optical Interconnect for Cross‑Region AI Compute – Ara 1.6T and Teralynx T100 Switch
- Musk: Tesla AI6 Chip Could Set a New Record for Compute per Wafer
- AMD Sweeps Amazon US CPU Best‑Seller List – Top 15 All AMD, Zero Intel
- China Big Fund Exits MEMS Fab Silex Beijing – Silex Micro to Take Full Ownership
- Unigroup Guoxin Completes IPO Coaching, Moves Closer to STAR Market Listing
- Google Orders >3 Million Intel‑Made TPUs, Intel Stock Jumps 13%
- Microchip Launches dsPIC33CK Value DSC – Low‑Cost, High‑Performance Real‑Time Control
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- PRINANO’s Vacuum Nanoimprint PL‑AS Mass‑Produces 8‑Inch Optical Chips at 1/10 DUV Cost
- WSTS Raises 2026 Semiconductor Forecast to $1.51T, Memory up 250%
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Quantinuum Upsized IPO to $1.46B, Valuation Hits $14.3B on Strong Demand
- NXP PRF947: A Comprehensive Technical Overview of Next-Generation UHF RFID ICs
- NXP TDA18275HN/C1: A High-Performance Silicon Tuner for Advanced Digital Television and Set-Top Box Applications
- NXP PHT11N06LT: A Comprehensive Technical Overview of the 60 V, 11 mΩ Logic Level MOSFET
- NXP TDA18275AHN/C1: A High-Performance Silicon Tuner for Advanced Digital TV and Set-Top Box Applications
- NXP PHK31NQ03LT: A High-Performance P-Channel TrenchMOS Logic Level FET for Advanced Power Management
- PSMN2R2-25YLC: NXP's Benchmark 25V Power MOSFET for High-Efficiency, High-Current Applications
- Intel Debuts 18A Xeon 6+, E835 Ethernet, and Xe3P GPU at Taipei Show
- The NXP PIMX8QX6AVLFZAB is a specific part number representing a member of the high-performance, ultra-efficient i.MX 8X applications processor family. This device is engineered for demanding embedded
- NXP PH9025L: A Comprehensive Technical Overview of its Architecture and Application
- Maxio’s First UFS 3.1 Controller Ships to Major China Customers, PCIe 5.0 Enterprise SSD Controller in Test
- TrendForce Raises 2027 Memory Market Forecast to $1.28T, Driven by Agentic AI
- Loongson Plans $317M Private Placement, LoongArch CPU Shipments Top 1 Million
- Kioxia Delays BiCS10 3D NAND Mass Production to 2027, Boosts Density 59%
- NXP SPC5606BF1MLQ6R 32-bit Microcontroller for Automotive and Industrial Embedded Systems
- NXP T1042NXE7MQB: A High-Performance Embedded Processor for Advanced Networking and Industrial Applications
- NXP SP124912MTGR: A High-Performance 12-Channel Switch Matrix IC for Advanced RF and Microwave Systems
- NXP SE95DP,118: A Comprehensive Technical Overview of the High-Accuracy Digital Temperature Sensor
- NXP SPC5605BF1VLQ6 32-Bit Microcontroller for Automotive Body Control Applications
- NXP SPC5602DF1VLL4R 32-bit Microcontroller for Automotive Embedded Systems
- NXP SPC5602PEF0MLL6R 32-bit Microcontroller for Automotive Body Control Applications
- NXP SJA1000T/N: A Comprehensive Overview of the Stand-Alone CAN Controller
- Panasonic, Kemet Raise Capacitor Prices Up to 65% as AI Server Demand Tightens Supply
- Russia Turns to Chinese AI Chips for GigaChat as Western Sanctions Bite
- Ex-Samsung Exec Predicts Memory Chip Prices to Drop in H2 2027 as China Ramps Capacity
- Anlogic Launches ELF5 and Phoenix 1P FPGAs, Shifts from Local Substitute to Industry Leader
- Xiaomi Confirms New Xuanjie Chip in 2026, First Gen Surpassed 1M Shipments
- NXP PMEG3020EJ,115: A High-Performance Schottky Barrier Diode for Modern Circuit Design
- Apple Taps Intel’s 18A-P for A/M Series Chips, Ending TSMC’s Exclusive Grip
- NXP PMEG6020ETR,115: A High-Performance Schottky Barrier Diode for Advanced Power Efficiency
- Unlocking the Potential of the NXP MFRC523: A Comprehensive Guide to High-Frequency RFID Reader IC Design and Implementation
- NXP S912ZVC12F0VKH: A Comprehensive Technical Overview of the 16-bit Automotive Microcontroller
- NXP PCA9554BS: A Comprehensive Guide to the Low-Voltage 8-Bit I2C I/O Expander
- NXP PESD5V0U1UB,115: Ultra-Low Capacitance ESD Protection Diode for High-Speed Data Lines
- PCF8566TS Universal LCD Driver for Low-Multiplex Displays
- NXP PCA9553DP/02: A Comprehensive Guide to the I²C-Bus I/O Expander
- Microchip Launches LAN878x/LAN888x Single-Pair Ethernet PHYs with MACsec for Automotive and Industrial Use
- SG Micro Launches SGM51633S2: 16-Bit SAR ADC with 333ns Delay and 93dB SNR
- indie Semiconductor Buys ams OSRAM’s CIS Business for €40M
- NXP BLF8G10LS-300P: A High-Performance LDMOS Transistor for Industrial and Scientific RF Applications
- NXP PCAL9539AHF: A Comprehensive Technical Overview of the Low-Voltage 16-Bit I2C-Bus I/O Expander
- NXP 74HC4051DB: A Comprehensive Guide to the 8-Channel Analog Multiplexer/Demultiplexer IC
- NXP PCA9552PW,118: A Comprehensive Technical Overview of the I²C-Bus I/O Expander
- LPC812M101JDH20J: NXP's 32-bit ARM Cortex-M0+ Microcontroller for Compact Embedded Designs
- NXP 74HCT2G14GW: A High-Speed Dual Inverting Schmitt-Trigger Oscillator Solution
- NXP 74LVC4245ABQ: A Comprehensive Guide to the 8-Bit Dual-Supply Bidirectional Voltage Level Translator
- NXP 74LVC1G04GW-Q100: A Single Inverter Gate IC for High-Performance, Automotive-Grade Digital Applications
- Global Semiconductor Packaging Market to Hit $618.9B, Fueled by AI and EVs
- World’s Largest MEMS Foundry Silex Lists on Nasdaq Stockholm
- Arm Q4 Revenue Hits $1.49B Record – AI Drives Royalty Surge
- AMD Q1 Net Profit Jumps 95% – Samsung Breaks $1 Trillion Market Cap
- NXP LPC2138FHN64: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- NXP LPC2119FBD64/01EL: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- NXP MC33PF8100FJESR2: A Comprehensive Overview of the Advanced System Basis Chip for Automotive Applications
- NXP LPC1125JBD48/303: A Comprehensive Technical Overview of the ARM Cortex-M0 Microcontroller
- The NXP FS32K142HFT0MLLR is a highly integrated 32-bit microcontroller from NXP Semiconductors' S32K1xx family, specifically designed to meet the rigorous demands of automotive and industrial app
- NXP BT134W-600D: A Comprehensive Technical Overview of the 4A Triac for AC Load Control
- NXP BZA856AVL: A Comprehensive Technical Overview of the High-Performance ESD Protection Diode Array
- NXP 74HC573PW: An In-Depth Look at the High-Speed Octal D-Type Latch IC
- Renesas Q1 Operating Profit Soars 49.6% – Data Center & Auto Drive Beat
- MPC860DTCVR50D4: A Comprehensive Technical Overview of NXP's PowerQUICC Embedded Processor
- NXP MKV46F256VLL16: A Comprehensive Technical Overview of the Kinetis K Series Automotive MCU
- NXP SC33771CTA1MAE: A High-Performance Automotive System-on-Chip for Next-Generation In-Vehicle Applications
- NXP P3041NSN7PNC: A Comprehensive Technical Overview of QorIQ's Advanced Processor
- NXP TDA8007BHL/C3: A Comprehensive Technical Overview of the Dual Smart Card Interface IC
- NXP TJA1043TKY: High-Speed CAN Transceiver for Automotive Networks
- NXP PCA82C250: A Comprehensive Guide to the CAN Bus Transceiver
- The NXP FS32K144HFT0VLL is a member of the S32K1xx family of 32-bit Arm® Cortex-M-based microcontrollers designed specifically for the rigorous demands of the automotive industry. This particular vari
- Xiaomi XRING O3 Chip Leak – 4GHz+ Prime Core and Full Architecture Overhaul
- Tokyo Electron Cuts Ties with China Chief Over Secret Startup Ties
- Bosch Launches 3rd‑Gen SiC Chip – 20% Performance Leap for EVs
- Japan 7.7 Magnitude Earthquake Hits Semiconductor Hub – Kioxia & Tokyo Electron Report No Damage
- Diodes AL8859Q – Automotive SPI Boost Controller for Headlight Systems
- UMC and eMemory Restart Memory Foundry in Japan – 2D NAND & NOR Flash
- Huawei Launches Kirin 9030S with 200% AI Performance Surge – Pura 90 Series First
- Chinese Semi Equipment Leader ACM Research Plans Hong Kong Listing
- Yuanjie Technology Tops 1,410 Yuan, Dethrones Moutai as A-Share “Stock King”
- ASE Invests $443M to Acquire Innolux Fab – Advanced Packaging Capacity Surges